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Last updateSat, 19 Aug 2017 2pm
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Printed Electronics

HID Global’s Seos Smart Cards and HID Mobile Access Bring Convenience, Security and the Mobile ID “Cool” Factor to Major U.S. University

HID Global®, a worldwide leader in trusted identity solutions, today announced a major U.S. university selected its Seos® smart cards and HID Mobile Access® solution to streamline card office operations, simplify the management and use of trusted IDs, and offer the “cool” factor to students using phones for accessing buildings, services and resources. The phased deployment of thousands of readers over the last few years enabled these benefits, while preserving investments in previously installed HID Global readers.


SPGPrints highlights reliability of non-woven nickel RotaMesh® and PlanoMesh screens for printed electronics at LOPEC 2017

SPGPrints will showcase its high-performance, electroformed-nickel rotary and flatbed screen printing solutions for cost-effective, precise production of electronic devices at the LOPEC 2017 fair, (Hall B0, Stand 500, Messe München convention centre, Munich, March 29-30th, 2017). Applications include photo and organic voltaics, electronic and bio-sensors, touch panels, LEDs and multiple-layer flexible circuit boards.

Smithers Apex to host printed electronics roundtable on car of the future at LOPEC

Smithers Apex, which provides market research, publications, strategic and technical consulting to niche, emerging, and high-growth industries, has announced its Head of Publishing, Dan Rogers will be moderating the LOPEC roundtable, which will be discussing the opportunities and challenges for printed and organic electronics in automotives.

Whether as a Plug-In or in Embedded Form – the SkySIM CX Hercules from G&D Makes Mobile Transactions More Convenient and Future-Proof

Mobile devices are increasingly being used for mobile transactions such as electronic payments, as well as for digital tickets and for authentication in physical access control systems in secure areas. Such use involves the exchange of highly sensitive personal data, which makes security a top priority. The Munich-based technology group Giesecke & Devrient (G&D) is now presenting the new SkySIM CX® Hercules for use in these scenarios. The combination of the new chip design and software allows multiple applications to be run simultaneously, securely, and at high speed. The solution has been approved by American Express, MasterCard, the People's Bank of China (PBOC), and Visa, and thus meets the requirements for secure payments. In terms of ticketing and physical access control systems, the product supports the MIFARE, CIPURSE, and Calypso standards.


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